![]() According to AMD it exhibits a 30% lower misprediction rate than its perceptron counterpart in the Zen/ Zen+ microarchitecture. The Zen 2 BPU almost doubles the branch target buffer capacity, doubles the size of the indirect target array, and introduces a TAGE predictor. The branch prediction unit guides instruction fetching and attempts to predict branches and their target to avoid pipeline stalls or the pursuit of incorrect execution paths. The µOP cache was also tweaked including changes to the µOP cache tags and the µOP cache itself which has been enlarged to improve the instruction stream throughput. This includes improvements to the prefetcher and various undisclosed optimizations to the instruction cache. AMD reported that the branch prediction unit has been reworked. In order to feed the backend, which has been widened to support 256-bit operation, the front-end throughput was improved. Most of the fine details have not been revealed by AMD yet. 4-Kbyte and 2-Mbyte pages, PDEs to speed up table walks.2,048 entry L2 TLB, 16-way set associative.512 entry L2 TLB, 8-way set associative.64 entry L1 TLB, fully associative, all page sizes.Up to PC4-25600L (DDR4-3200 RDIMM/LRDIMM), ECC supported.8 channels per socket, up to 16 DIMMs, max.Renoir: 4 MiB/CCX, shared across all cores.Matisse, Castle Peak, Rome: 16 MiB/CCX, shared across all cores.WBNOINVD - Write back and do not flush internal caches, initiate same of external cachesįurthermore, the User-Mode Instruction Prevention ( UMIP) extension.īlock Diagram Individual Core.CLWB - Write back modified cache line and may retain line in cache hierarchy.Zen 2 introduced a number of new x86 instructions: ![]() This list is incomplete you can help by expanding it. Decoupling of MemClk from FClk, allowing 2:1 ratio in addition to 1:1.2.3x transfer rate per link (25 GT/s, up from ~10.6 GT/s).Increased 元 latency (~40 cycles, up from ~35 cycles).2x 元 cache slice (16 MiB, up from 8 MiB).0.5x L1 instruction cache (32 KiB, down from 64 KiB).Larger Reorder Buffer (224, up from 192).Larger scheduler (4x16 ALU + 1x28 AGU, up from 4x14 ALU + 2x14 AGU.Increased number of registers (180, up from 168).2x wider LSU (2x256-bit L/S, up from 128-bit).2x wider EUs (256-bit FMAs, up from 128-bit FMAs).2x wider datapath (256-bit, up from 128-bit).Larger µOP cache (4096 entries, up from 2048).Higher IPC (AMD self-reported up to 15% IPC).Zen 2 inherits most of the design from Zen+ but improves the instruction stream bandwidth and floating-point throughput performance. Note: Initial support in GCC 9 and LLVM 9.The server I/O Die (sIOD) is fabricated on GlobalFoundries 14 nm process.The client I/O Die (cIOD) is fabricated on GlobalFoundries 12 nm process.The Core Complex Die (CCD) is fabricated on TSMC 7 nm HPC process.Zen 2 comprises multiple different components: 2 ECC support is unavailable on AMD APUs. Ryzen brand logo AMD Zen-based processor brandsġ Only available on G, GE, H, HS, HX and U SKUs.
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